JPS6225904Y2 - - Google Patents

Info

Publication number
JPS6225904Y2
JPS6225904Y2 JP1981123600U JP12360081U JPS6225904Y2 JP S6225904 Y2 JPS6225904 Y2 JP S6225904Y2 JP 1981123600 U JP1981123600 U JP 1981123600U JP 12360081 U JP12360081 U JP 12360081U JP S6225904 Y2 JPS6225904 Y2 JP S6225904Y2
Authority
JP
Japan
Prior art keywords
terminal
terminals
transistor
chip
straight line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1981123600U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5829846U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12360081U priority Critical patent/JPS5829846U/ja
Publication of JPS5829846U publication Critical patent/JPS5829846U/ja
Application granted granted Critical
Publication of JPS6225904Y2 publication Critical patent/JPS6225904Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Amplifiers (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP12360081U 1981-08-20 1981-08-20 チツプ型トランジスタ Granted JPS5829846U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12360081U JPS5829846U (ja) 1981-08-20 1981-08-20 チツプ型トランジスタ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12360081U JPS5829846U (ja) 1981-08-20 1981-08-20 チツプ型トランジスタ

Publications (2)

Publication Number Publication Date
JPS5829846U JPS5829846U (ja) 1983-02-26
JPS6225904Y2 true JPS6225904Y2 (en]) 1987-07-02

Family

ID=29917498

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12360081U Granted JPS5829846U (ja) 1981-08-20 1981-08-20 チツプ型トランジスタ

Country Status (1)

Country Link
JP (1) JPS5829846U (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60113955A (ja) * 1983-11-25 1985-06-20 Hitachi Ltd シングル・ゲート型ＧａＡｓＦＥＴ

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4910463U (en]) * 1972-04-28 1974-01-29
JPS5247382A (en) * 1975-10-13 1977-04-15 Toshiba Corp Varactor diode device

Also Published As

Publication number Publication date
JPS5829846U (ja) 1983-02-26

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